Meet us at Interpack, May 4-10, 2017


From Thursday May 4th till Wednesday May 10th, 2017, the Engilico team will demonstrate how SealScope™ can improve your packaging quality and line output at  Interpack 2017 in Düsseldorf, Germany.

SealScope™ is the first in-line, non-destructive seal inspection & monitoring technology for flexible packages like pouches, pillow bags and flowpacks. We invite you to come and experience SealScope™ at the booth of  the following packaging machine partners:

  • SN Maschinenbau – Roll stock pouches – Hall 8a, booth A06
  • Omori Europe – Horizontal flowpacks – Hall 8, booth C/D66
  • Leepack – Pre-made pouches – Hall 8b, booth D42

We are looking forward to seeing you in Düsseldorf!