We invite you to come and experience SealScope™, the non-destructive, in-line seal inspection & monitoring technology for flexible packages, on PACK EXPO Las Vegas
at the Convention Center in Las Vegas, NV, USA.
From Monday September 25th till Wednesday September 27th, 2017,
the Engilico team will demonstrate how to improve your packaging productivity and the quality of your flexible packages.
We are exhibiting at booth #C-4840 of our partner PPi Technologies Group.