HyperScope® receives JAPAN PACK Excellence Award 2023

Japan PACK Awards 2023

At the JAPAN PACK show (Oct 3-6, 2023), HyperScope® was awarded with the JAPAN PACK Excellence Award. Japan PACK is a leading Packaging & Manufacturing Technology show organized by Japan Packaging Machinery Manufacturers Association. This year’s exhibition focused on automation and the environment, which are currently of increasing interest. The prize was received by the PACRAFT team during the award ceremony at the Tokyo Big Sight Exhibition venue. Engilico is since 2021 part of PACRAFT packaging company, and part of the Japanese Nabtesco group.

“We are very proud that the HyperScope® solution received the 2023 Japan Pack Excellence Award!”, comments Olivier Georis, Managing Director and CEO of Engilico,  “It is encouraging that leading people in the Japanese packaging industry recognize the innovation that HyperScope® brings in the seal inspection of rigid packages such as thermoforms, trays and cups.”

HyperScope® is an innovative, in-line seal inspection solution for rigid trays and thermoforms. The inspection solution uses  hyperspectral imaging (HSI) and artificial  intelligence technology to detect contamination in the seal of plastic or cardboard trays with a much higher contrast than standard vision cameras, and can even detect contamination through printed plastic  foils.  Typical applications  include  the  inspection  of  trays  containing (slice or chopped) meat, ready meals, cheese, snacks, vegetables, etc.